You are here: Home » Products » Advanced Ceramics » Alumina Powder » Subglobular Alumina Powder for High Thermal Conductive Material » Subglobular Alumina Powder for High Thermal Conductive Material

Subglobular Alumina Powder for High Thermal Conductive Material

Availability:
Quantity:

SUBGLOBULAR ALUMINA POWDER FOR HIGH THERMAIL CONDUCTIVE MATERIAL

 

                         

This product is a subglobular alumina powder with green density, good dispersity and good interface compatibility with organic polymer material. It meets the requirement of high filler content. The particle size distribution is narrow and the product is with high purity, good heat conductivity and insulation. Besides the normal products, we also provide products subject to customers’ needs of average particle size covering from 1-3μm 、5-7μm、10-12μm, and 20-25μm high thermal conductivity spherical alumina.


Applications:


This product is mainly applied to high polymer materials of organic silicon-based and epoxy, and used in thermal conductive pad, heat conductive silicone grease, potting compound and electrical packaging. It also can be a substitution of the imported like products.


Main Technical Parameters:



Grade 

Technical Data

SAC-A-10

SAC-A-20

SAC-A-30

SAC-B-01

SAC-B-02

SAC-B-03

 

Chemical

Component

SiO2 %   

0.15

0.10

0.05

0.12

0.10

0.10

Fe2O3%  ≤

0.03

0.03

0.03

0.05

0.05

0.04

Na2O %  ≤

0.05

0.05

0.04

0.10

0.10

0.05

Attached water % ≤

0.05

0.05

0.05

0.10

0.10

0.10

Loss on ignition % ≤

0.05

0.05

0.04

0.05

0.05

0.05

 

Physical

Properities

Average particle size

(um)

8-10

15-22

30-45

1.8-2.0

2.7-3.3

7-9

a-phase % ≥

95

95

95

95

95

95

Oil absorption

(g/100g Al2O3)

15

12

10

/

/

/

PH 

6-9

6-9

6-9

6-9

6-9

6-9

Conductivity (μs/cm) 

50

50

50

/

/

/


Fast navigation
Copyright © 2021 Henan Suntek International Co.,Ltd